Viscom

As a pioneer in the field of industrial image processing, and with its unique range of products, Viscom is one of the most important suppliers of optical inspection systems worldwide. A wide spectrum of products offers applications for practically every customer's need. Constant development of new products and refinement of tried-and-proven standard applications ensures that Viscom inspection systems remain state-of-the-art. Especially in printed circuit board inspection, Viscom has assumed a position of global leadership.

Whether it is PCBA inspection, X-ray inspection, micro system inspection, semiconductor inspection, inspection solutions for the photovoltaic industry or customer-specific solutions, Viscom inspection systems maintain an impressive technological level. Additional modules such as a programming station, repair station, and statistical process control guarantee not only fail-safe defect detection, but also make possible comprehensive process control in production.

Automatic Optical Inspection (AOI)
With the help of inspection systems, defects during paste print, component placement, soldering or final assembly are identified. Viscom inspection systems ensure rapid, reliable, 100% monitoring of the production process, e.g. S2088, S3088-II

Automatic X-ray Inspection (AXI)
Concealed defects, invisible to cameras, can also be detected, with the help of X-ray technology. In an age of increasingly compact components and accompanying advances in miniaturization, non-destructive testing of details that are hidden from view is gaining in importance. This technique makes it possible to prevent reject products, even in the earliest production stages. Classical applications include the inspection of die attachments, wire bonding in a sealed state or enclosed within housings, as well as solder joint inspection of concealed assemblies such as BGA, µBGA, FlipChip, Bumps, and connector attachments, e.g. X8008

Combined Optical and X-ray Inspection (AOXI)
In many sectors, automatic optical inspection (AOI) is no longer sufficient to inspect assemblies for paste print, placement and solder joint defects. Miniature housings such as BGA, µBGA, CSP or FlipChips are used more and more and also require a cost-effective, reliable inspection. Combining X-ray with optical inspection can "kill two birds with one stone" and so grant high inspection depth and maximum throughput, e.g. X7056