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On the 14th and 15th of March 2012, current discussions concerning electronics assembly production find a platform in Hanover. Experts from various specialist disciplines present up to date results and discuss trends in SMD and Electronics. Among other topics, they present reports over the current state of 3D MID technology, display how simulation can assist evaluation of solder joints and provide information about various solder pastes and their influence on inspection methodology.

Of course Viscom will also be casting a glance beyond the immediate bounds of the subject. In the opening presentation, Prof. Dr. Bernd Weber from the Center of Economics and Neuroscience in Bonn will present the latest findings from the field of brain research - experiments and investigations to help us better understand how humans meet decisions.

During the cost-free workshops presented in the User Meeting, Viscom experts will present information about new system features and be ready to advise participants. On the second day of the meeting, in parallel with the entire event, Viscom will also be conducting a system exhibition in their demo room for throughout the day. Viscom contact partners from Sales and Application will be available to offer you a concise introduction to the systems.

Registrations are accepted until 10 February 2012. Please contact W&S for more information!

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