Viscom
Optical /3D X-Ray Inspection
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X7056
Worldwide Unique
Simultaneous Optical and
3D X-ray Inspection
X7056 brochure |
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Application Areas
New electronic products are arriving to the market today at increasingly rapid cycles. Time allowed for development and modeling is getting shorter, as demands for quality rise. The automatic optical inspection (AOI) of printed circuit boards is accepted worldwide.
Manufacturers with miniaturized components such as BGAs, µBGAs, CSPs and FlipChips require a positive and cost-effective quality inspection process that also locates concealed defects - with extensive inspection depth and high throughput. |
Only recognizable with AOI:
SOIC polarity
Only recognizable with AXI: BGA bridge
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Highlights
Simultaneous optical and X-ray inspection
3-D X-ray inspection with selectable resolutions of 5, 7 or 10 μm per pixel
High performance, tomosynthesis-based 3-D X-ray back calculation
Optical inspection with 11.7 and 23.4 μm resolution
Short handling time
Reduce false alarms with AXI-OnDemand
Compact housing dimensions:
only 1.3 m (X7056RS) or 1.7 m (X7056RL) wide
Additional options
Verification, off-line programming and SPC evaluation
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