Metcal / OKI

APR 5000	APR 5000-DZ	APR 5000 XLS	APR 5000 Accessories

As the implementation of lead-free assemblies intensifies, the APR-5000 Array Package Rework Systems have the power, size and sophistication to meet the required higher, cost-sensitive performance criteria.

The innovative OK International single reflow/placement head design helps achieve a consistent, tight Delta T across the board and the component. Thermal damage is precluded due to the system's precisely controlled pre-heaters; lead-free profiles can be quickly developed via the system's five thermocouples; and closed-loop, computer controls and intuitive software help operators maintain the ideal process from start to finish.

The APR-5000 Array Package Rework Systems provide full convection in both reflow heater and pre-heaters to provide fast ramp and precise peak reflow temperature without thermal damage to sensitive components unsuitable for heating above 240°C. And with four heating zones and one cooling zone, the precise profiles needed for successful soldering/desoldering of lead-free packages are easily delivered.