Koh Young Technology Inc.
3D Solder Paste Measurement & Inspection Systems
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The majority of SMT defects are found during the solder paste printing process.
Screen printer defects occur randomly without a regular pattern and the defect rate of SMT will significantly decrease if real-time monitoring and maintenance of the screen printer operation are possible. This optimization of screen printing process helps SMT process engineers improve and maintain high manufacturing yields.
With many factors and multiple variables in the paste printing process, however, it is difficult to manage and predict each succeeding interactions. Therefore, optimization without real-time and accurate management of the process is unattainable. With unparalleled accuracy and repeatability based on its patented shadow free 3D measurement technology, Koh Young’s 3D Solder Paste Inspection System overcomes Shadow Effect providing the most accurate results available. This enables meaningful process control with various types of statistical data and defect analysis.
Koh Young is your ONLY true yield improvement partner and is recognized as market leader in the intelligent 3D inspection and measurement area.
Koh Young’s 3D Solder Paste Inspection Systems
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