Kester
Solderpaste
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Standard Solder Paste  |
Standard Powder: Class 3 - typical particle ø 25 to 45 micron, mesh designation -325+500
Standard Alloys: |
Type |
Packing |
Sn62Pb36Ag0.2 |
R256 Easy Profile |
jar 500 gr. |
Sn62Pb36Ag0.2 |
syringe 35 gr. |
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The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes have flux systems for lead-free assembly. They promote good wetting and excellent solder joint integrity at higher temperatures commonly seen with most lead-free alloys, such as Sn-Ag-Cu (tin-silver-copper).
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Standard Alloys: |
Type |
Packing |
Sn95.5Ag3.8Cu0.7 |
jar 500 gr. |
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