Kester

Fluxes

Soldering Flux 979	Waterbased VOC-Free, No-Clean
datasheets	The 979 is a completely new, organic, no-clean formulation for high quality, low-defect soldering of electronic ciruit board assemblies. Its chemistry is free of any volatile organic compounds (VOCs), solvents that may react photochemically to form air pollution (smog).

Soldering Flux 950E	Alcohol based, No-Clean
datasheets	A halogen-free, rosin free organic flux designed for the high speed wave soldering of through hole and surface mount printed circuit board assemblies. Non-corrosive and non-conductive, having an extremely low solids content, and leaving no residue after soldering. This flux is designed for application with foam fluxing equipment.

Soldering Flux 959T	Low Solid, No-Clean
datasheets	A no-clean, non-corrosive, halogen free liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. Kester 959T was developed to minimize the formation of micro-solderballs during wave soldering operations. This flux contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. Kester 959T offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry and leaves evenly distributed residues for the best cosmetic appearance.

Soldering Flux 952S	Low Solid, No-Clean
datasheets	Kester 952 S is a halogen-free, non rosin organic flux designed for wave soldering conventional and surface mount circuit board assemblies. The extremely low solid content (2%) and nature of activator system results in practically NO RESIDUES left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing and the expense of cleaning is eliminated.

Fluxpens	186 (RMA, No-Clean) & 952D-06 (Pb free Rework flux)
	Eliminate the mess of flux bottles. The spring-loaded chisel tip dispenses just the right amount of flux, while a spring valve prevents the pen from drying out. Allows work to be performed in confined spaces, while limiting exposure to potentially harmful chemicals.

Tacky Flux	TSF 6592 & TSF 6516
	Tacky fluxes are designed for stencil/screen printing, rotating drum, pin transfer, dot dispensing, slide fluxers and/or syringe applications. Tacky fluxes are great for rework applications on all PCB packages of various electronic devices. Tacky flux can be used in BGA/PGA sphere/pin attachment vehicle, for repair and reballing/ repinning and as a tack and flux vehicle for soldering components to a solid solder deposit (SSD), or precision pad technology (PPT) board surfaces. This flux works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering paste flux.

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