IBL

Process description of heat transfer with a condensing vapour phase

	1. The assembly is moved to the vapour phase. It was preheated by IR radiators from the top. It also can be preheated on the upper boundary of the vapour phase predominantly from below. The use of IR preheat improves the quality of the solder joint and allows the free shaping of the temperature profiles.
	2. The assembly dives into the vapour phase. There, it is heated up. With a patented procedure, it is possible to control the heat transfer to the assembly in a way that soft temperature rise is performed.
	3. The vapour condenses on the assembly and transfers its heat. Since the vapour is chemical inert, it performs an inert gas atmosphere with 0 ppm oxigen. This is done automatically without the use of nitrogen.
	4. The assembly can be heated up to a maximum temperature that equals the temperature of the vapour. This temperature cannot be exceeded even if the assembly stays longer inside the vapour. Therefore, no overheating is possible.
	5. After leaving the vapour phase there is still condensed fluid left on the board. Due to the inner heat of the assembly, the liquid evaporates and a dry assembly leaves the machine