Heller Industries

Heller Industries the recognized World Leader in Reflow Soldering Oven Technology announces a true breakthrough in Reflow soldering technology with the new Mark III series. With over 12,000 systems installed worldwide, Heller has been at the leading edge of Forced Hot Air Reflow soldering technology development since 1987. Heller utilizes a partnership approach with their customers to develop user-initiated solutions for real world applications. The Mark III system is yet another major advancement with innovative Technologies including:
	Lead Free Certified Systems —More Lead free product has been run on Heller machines than any other! Heller has pioneered the Lead Free Reflow process by working closely with the Japanese OEM’s and International ODM’s and EMS’s to refine the Lead Free process. The Mark III system includes features that provide: “Spike Zone” design to minimize liquidous time Ultra fast cooling rates of 3-5 Deg/Sec to form perfect grain structure More heated zones than any other competitor to allow “Profile Sculpting”

Maintenance Free Systems —the New Gen 5.2 and 9.2 Flux Removal systems virtually eliminate flux from the heated tunnel and reduce maintenance time from hours per month to brief times per quarter. Flux is captured in jars so it can easily be seen and quickly cleaned. Valuable production time is “re-captured” due to the huge decrease in maintenance.

Lowest Cost of Ownership —With Heller’s new Balanced Flow Heater Module (BFM) technology the cost of running nitrogen has been reduced by up to 50%! And the LOW KW features have reduced Electrical consumption by up to 40%!

New Flux System virtually eliminates Maintenance
This new flux collection system traps the flux in a separate collection box with easy to remove plates. As a result, the oven tunnel is kept clean, thus saving time consuming P.M. A collection jar captures the flux and can be removed while the oven is running for the ultimate in time savings!